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于我們_20240828.jpg)
0571-82835676
CH
Product
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High flexibilityProgrammable switching chip, flexible configuration of traffic path
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High reliabilityPowerful computing power, up to 2 high-performance processors and 32 DDR4 memory modules
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High densityHigh-density port configuration to meet data center networking requirements
- Application scenario
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- Server Room
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- HPC Supercomputing Center
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- AI Data Center
- Technical specification
| Name | Specifications |
| Calculation | Supports up to 2 high-performance processors, each with up to 40 cores Maximum power 270W |
| Memory | Up to 32 DDR4 DIMMs, maximum speed 3200MT/s, RDIMM or LRDIMM Maximum memory capacity up to 12TB |
| Storage | Built-in SATA SSD (*2), default 480GB; Built-in NVME hard drive (*1), default 480GB |
| Network | Supports 36*QSFP28 Ethernet ports and 4.5W optical modules Supports one 1 Gbit/s shared network port Supports 1/10/25/40/100 GE network adapters based on standard PCIe slots |
| Interface | 1 RJ45 serial port, 1 USB 3.0 port |
| Expansion slot | Support 3 PCIe4.0 standard slots |
| Switching chip | BFN T10-064 - q / 6.4 -tbps |
| BMC | AST2500 |
| Power module | Depending on the configuration, platinum 2000W/3000W CRPS power supply, 1+1 redundancy, optional titanium power supply |
| Fan module | Support 3+1 redundancy, support hot swap, electronic label, forward and rear air outlet |
| Chassis size | 440mm(W) *88.1mm (H) 780 (D) mm |
| Operating temperature | 0~40℃ |
| Working altitude | 0m~1800m |
| Relative humidity of working environment | 5% ~ 95% |
| Storage temperature | -40℃~70℃ |
| Storage humidity | 5%~95% |