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CNIT manufacturing -ability
- Perfect manufacturing platform
A wide range of device platforms covering different fields
Competitive veneer and machine manufacturing services
Trial production, mass production independent capacity, support fast and flexible demand response ability
- Strong process capability and quality assurance
High-end (25G signal rate,), complex (70000 PIN, 34-layer PCB), large size PCBA (1200*510mm)
Rigid, flexible, soft and hard combination plate
01005, large size BGA (102mm*102mm), 180mm length SMD and other types of device capability
Complete end-to-end material and process quality data traceability
- Flexible collaboration model
CM, ODM, feed processing and other multi-mode production organization and manufacturing capacity
OEM, full OEM, partial OEM, VMI, material co-management and other types of end-to-end collaboration
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CNIT manufacturing - Single board
15 FUJI NXTIII and Global patch cables
8 trays wave soldering/selective wave soldering, plug-in welding wire
Vitrox 810 EX/XLT, TRI 7600SIII 5D/3D X-ray
Agilent 3070, Teradyne TSLX/Spectrum 88series, TRI MDA
5 UV/ infrared coating lines
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CNIT manufacturing - Complete machine
Assembly
Assembly line for configuring on-line small purification room,
From small box products to 4U/6U server complete
Large rack products such as micro modules/PDC/Converged cabinet
Test
Independent development of test equipment and test scripts
Multi-point FT/ST configuration on demand, 1000+ ST test bits dedicated to server products
Support customer test network local deployment, can provide real-time test data docking/upload
Reliability
Assembly line for configuring on-line small purification room,
7 ESS test boxes, 1 HASA/HALT test box
Two independent aging rooms of 119㎡+64 ㎡, supporting temperature range of 40-90℃
CNIT manufacturing - Process
| Project | Ability | ||
| PCB Size | Long | 50 ~ 900mm | |
| Width | 50 ~ 600mm | ||
| Thick | 0.508 ~ 6.0mm | ||
| PCBA Weight | SMT | ≤ 6kg | |
| Patch | Weight | Device weight/Adsorption area | ≤ 0.288g/mm² |
| Device maximum weight | ≤ 255g | ||
| Size | Minimum size | 1005 | |
| Size range of machined components | 0.25*0.125 mm² --102*102 mm² | ||
| Special Insert machine | Maximum cartridge pressure (N) | 98N | |
| Pluggable devices | VGA interface,USBSocket, pin, all kinds of shaped parts,DIMM, switch buttons, high-speed communication ports, network port connectors,PCIESocket etc | ||
| Maximum size of pluggable devices (L*W*H) | 145mm*26mm*45mm | ||
| Plug-in accuracy tolerance (mm) | ± 0.TestVeneer processComplete line configuration SPI, 3D AOI, AXIBoard functionICT: supports 7680 test points MDA: supports 1280 test points BSI: customizes test items and parameters according to customer requirements FBT: customizes test items and parameters according to customer requirementsServer/Network products/Other productsFT/ST: Customized test items and parameters according to customer requirements HASA: temperature -40℃~80℃, rapid temperature change up to 40℃/min, vibration frequency 20Grms ESS: 9 sets, temperature -20℃~80℃, temperature change 10℃/min linear ORT/Burn-in: A total of 2 sets, high temperature 40~55 degrees, according to customer needs to determine the test time |
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CNIT manufacturing - Quality
Cloud tip manufacturing - equipment
SMT production line has the most complete process/equipment configuration, using the industry's mainstream first-line brands, according to customer needs to set up product lines
Cloud tip manufacturing - equipment
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Self-energy
Bunker system -
Auto
Steel mesh
Inspection machine -
Brain power
Nozzle
Cleaning machine -
Mount head
Automatic
Maintenance machine -
X-RAY
Material dispenser